公告:
Introduction

     The chip semiconductor industry is an important part of China’s manufacturing. In the context of the steady growth of the global semiconductor industry, China’s domestic wafer and silicon factories have expanded significantly in the past two years. With the emergence of a large number of application backgrounds such as artificial intelligence, big data, cloud computing, virtual reality, smart power grid, satellite navigation, automotive electronics, Internet of Things and industrial Internet applications and 5G communications, and the national and local governments’ large capital investment and guidance in terms of integrated circuit manufacturing, packaging and testing, equipment and materials, the semiconductor chip industry will grow at a rate of more than 20% in the next few years. This brings opportunities to related equipment and material manufacturers.

    In 2020, it is expected that in terms of output value, China’s industrial Internet industry will exceed RMB 1 trillion, the Internet of Things application industry will exceed RMB 1.5 trillion, the artificial intelligence will increase significantly, close to RMB 100 billion, the new energy vehicles will reach 2 million, and there will be 50 billion devices linking 5G communications worldwide by 2020, thus bringing rapid growth to the chip semiconductor industry. New projects developed with overseas capital and domestic capital investment in the past three years will start mass production in 2018-2019, and the demand for semiconductor equipment will exceed RMB 200 billion. As of May in 2018, 15 provinces and municipalities across the country had established semiconductor integrated circuit funds to support the development of the industry. The second phase of the Semiconductor Fund is also under preparation, and the overall investment scale driven by the semiconductor industry will reach RMB 1 trillion. Meanwhile, in the links of packaging & testing and manufacturing, with the trend of global industrial transfer and China’s huge semiconductor consumer market, it is foreseeable that the rapid growth of the semiconductor industry, the industrial cluster effect and the wealth opportunities of the industrial chain will become more prominent

     Semicon China 2019 Shenzhen and Summit Forum will be held concurrently with the 4th Shenzhen International Mobile Phone 3C Smart Manufacturing Exposition. With a total exhibition area of 50,000 square meters, it is in line with the trend of industrial development, responds to the call of policy, and serves the needs of industrial chain cooperation. In addition to the exhibition of materials and advanced equipment, it will bring together top experts and capital giants to have a dialogue with design, manufacturing, packaging and testing, materials and equipment manufacturers and share new opportunities for industrial wealth.

Exhibition scope:

Semiconductor design, packaging and testing, manufacturing companies

Raw materials

-----Silicon wafers, photoresists, photomasks, special gases, CMP polishing materials, wet electronic chemicals, sputtering targets, packaging and testing materials;

Production equipment

-----Single crystal furnaces, oxidation furnaces, diffusion equipment, ion implantation equipment, PVD, CVD, lithography machines, etching machines, polishing machines, chamfering machines, gluing/developing machines, front-end test equipment, wet process equipment, thermal processing and coating equipment, single wafer deposition systems, cleaning equipment;

Packaging process

------Thinning machines, dicing machine, chip mounters, wire bonders, laminating machines, bending equipment, sorting machines, testing machines, grinding fluid, dicing solutions, sealing film (glue), high temperature tapes; other materials and equipment.

Review of the previous exposition:

    Semicon China 2019 Shenzhen and the 3rd Shenzhen International Mobile Phone 3C Smart Manufacturing Exposition (Smart Factory 2018) were successfully held during June 21-23, 2018 in Pavilion 2, 3 and 4 of Shenzhen Convention and Exhibition Center. The exhibition area was 40,000 square meters. 503 exhibitors exhibited their technical equipment and solutions in Pavilion 2, 3 and 4. The exhibition lasted 3 days, featuring the providers of semiconductors, 3C smart manufacturing, mobile phone automation, sensors, etc. Several technical summits were held during the same period.

Semicon China 2019 Shenzhen and the 3rd Shenzhen International Mobile Phone 3C Smart Manufacturing Exposition (Smart Factory 2018) were successfully held during June 21-23, 2018 in Pavilion 2, 3 and 4 of Shenzhen Convention and Exhibition Center. The exhibition area was 40,000 square meters. 503 exhibitors exhibited their technical equipment and solutions in Pavilion 2, 3 and 4. The exhibition lasted 3 days, featuring the providers of semiconductors, 3C smart manufacturing, mobile phone automation, sensors, etc. Several technical summits were held during the same period.


Source of visitors:

Professional visitors

1. Semiconductor design and manufacturing and OEM companies

2. Semiconductor packaging and testing manufacturings

3. Wafer and silicon manufacturers

4. Semiconductor material and equipment manufacturers

5. Industrial investment funds

Applications

1. Home appliances and consumer electronics (mobile phones, wearables, mobile products, VR/AR)

2. Car electronics

3. Internet of Things applications

4. Smart home, smart elderly care, smart city, Internet of Things applications

5. Industrial Internet of Things

6. High-end equipment, smart manufacturing, robots, drones

7. Industrial automation

8. Aviation and navigation, shipping, military electronics

9. Rail, transportation, energy and chemical industry

10. 5G communications

11. Other industries

Concurrent exhibitions:

Smart Factory 2019

The 4th Shenzhen International Mobile Phone 3C Smart Manufacturing Exposition

 

Concurrent forum:

2019 Shenzhen International Semiconductor Industry Cooperation Summit

Publicity plan:

In cooperation with more than 30 industry associations in the industry and more than 50 industry media agencies, and through the integration of online and offline resources, a number of channels will be used to promote the exposition, including the website, WeChat, EDM, magazines, TV stations, outdoor advertising and professional network promotion platforms. In addition, exposition news will be regularly and accurately sent to industry users by email blast, SMS, telemarketing, etc.

1.5 million various promotional brochures, leaflets, posters, handbags, tickets and so on will be handed out throughout the year. We will participate in industry exhibitions and new technology and product launch conferences, and carry out other diversified marketing activities to promote the exposition and invitation industry buyers. Through the big data marketing program, we will deeply explore and analyze the possible visitors of the exposition and through the integration of online and offline channel resources, we will make contact with and radiate industry users more accurately and flexibly.

In cooperation with industrial parks and high-tech parks in South China, East China and other areas, we will invite semiconductor design and manufacturing and OEM companies, semiconductor packaging and testing companies, wafer and silicon manufacturers, as well as the companies in the fields of 5G communications, computers, communications, home appliances, consumer electronics, automobiles, Internet of Things, high-end equipment, smart manufacturing, robotics, drones, aviation and navigation, ships, military electronics, rail, transportation, new energy, etc. The organizer will arrange for 300 free buses to travel through the core areas of South China, including Guangzhou, Shenzhen, Dongguan and Zhongshan.

Visitor invitation plan:

500,000 professional databases, special buyers will be invited for accurate matching, procurement matchmaking meeting will be organized, and one-to-one communication will be arranged

1.5 million tickets, which will be accurately delivered to VIP visitors and distributed at the exhibitions throughout the year.

500 VIP group buyers will be picked up by special buses, and they will also invited to participate in a series of activities free of charge, such as concurrent summit meetings

2 million text messages will be sent every month, and 1.8 million e-mails will be sent to promote exposition and exhibitor news every month

More than 50 media agencies will promote exposition and exhibitor news online and offline


前書き:

  半導体産業は中国製造の基盤産業となっており、世界における半導体産業が堅調な成長を遂げていることを背景として、中国におけるシリコンチップ工場やウエハ工場の規模が過去2年間で大幅に拡大しており、人工知能、ビッグデータ、クラウドコンピューティング、バ—チャルリアリティ、スマートグリッド、衛星ナビゲーション、車載エレクトロニクス、IoT、IIoT、5G通信などが大規模に応用され、さらに、国や地方政府は、集積回路の製造、パッケージング、テスト、装置及び材料に対する大規模な投資や導入に従い、今後数年間半導体チップ業界は20%以上の成長率に達すると見込みます。関連の装置メーカーや材料業者にとって、それは新しいチャンスです。

 2020年に中国のIIoT産業生産額が1万億元、IoT産業生産額が1.5万億元を突破し、人工知能産業の急成長が見られ、生産高はほぼ1千億元を超えます。新エネルギー車が200万台に達し、2020年まで、世界における5G通信のデバイスが500億基に達し、それhはチップ半導体業界の急速な成長を促進させます。過去3年間にわたって、海外資本及び国内資本投資による新プロジェクトが2018年から2019年にまで続々と量産段階に入るため、半導体装置への需要は2000億元を超えると予定です。2018年5月時点、中国の15省市において、産業の発展を支援するために、半導体集積回路基金を設定しており、国民大基金IIも検討の段階にあり、半導体産業を原動力に生み出す投資額が1万億元を達成すると見込みます。それとともに、 ICパッケージング・テスト・製造分野では、世界の産業移転や中国の巨大な半導体市場によって、半導体産業の急成長、産業クラスター効果及び産業チェーンによる発展機会も多くなります。

 2019年度・深セン国際半導体製造展示会のサミットとともに、第四回深セン国際携帯電話(3C)知能化製造展示会も開催され、出展面積が50,000平方メートルに達し、それは産業発展の動向に応じ、政策の方針を貫き、産業チェーンのニーズを満たす。材料や先端設備を展示するだけでなく、トップの専門家と大手企業が多く集まり、デザイン・製造・パッケージング・テスト・材料・装置などの業者間の対話に取り組み、産業の新たな機会を共有することを目指します。

前回の展示会に対する振り返り: 
     2018年6月21~23日、3日にわたり、2019深セン国際半導体製造展示会並びに第3回深セン国際モバイル3Cインテリジェント製造展示会(スマートファクトリー2018)を深セン会議展覧センターの2・3・4号館で開催され、大きな成功を収めました。出展面積は40,000平方メートル、503社は技術機器及び関連のソリューションを展示しました。3日にわたる展示会において、半導体、3C・知能化製造、携帯電話自動化、センサーなどの分野に取り組んでいる企業が集まり、複数の技術サミットも開催されました。

 今回の展覧会を開催するとともに、第4回深セン国際モバイル3Cインテリジェント製造展示会も開催され、出展面積が約5万平方メートルに達し、プロの来場者が5万人を超える予定です。

 宣传方案:

·30以上の業界協会と50以上の業界メディアの緊密な提携によって、オンラインとオンオフの資源を統合するだけでなく、ウェブサイト、WeChat、EDM、雑誌、テレビ局、屋外広告、プロフェッショナルネットワークプロモーションプラットフォーム及びその他のチャネルを統合することにより、展示会の広報活動を行い、メールの一括配信、SMS及びテレマーケティングという形で業界内のユーザーに向け開示会からの声を定期かつ確実にお届けいたします。 

·全年はパンフレット、リーフレット、ポスター、ハンドバッグ、チケットなど総計150万部の印刷物を発行します。業界向けの展示会、新技術・新製品発表会経由でビックデータマーケティング案を活用し、展示会の対象を分析ししたり、引きつけたりし、、オンライン・オフラインの資源を統合することによって、業界内のユーザーを直接且つ確実にカバーします。

·華南、華東などの地域にある工業団地、ハイテクパークと手を提携し、全方位の提携を図り、半導体設計・製造・OEM業者、半導体パッケージング・テスト企業、シリコンチップ・ウェーハ製造業者、5G通信、コンピュータ、通信ベンダー、家電及びコンシューマエレクトロニクス、自動車、IoT、ハイエンドな機器、知能化製造、ロボット、ドローン、航空・航海、船舶、軍用電装品、鉄道、輸送、新エネルギーなどの分野における企業のご出展を誘致します。主催者はバスを300台無料で手配し、広州、深セン、東莞、中山などの華南主要地域を走りま

观众邀请方案:

·プロデータベース50万を作成し、プロのバイヤーを特定し、調達面談会を開催することで1対1の交流を実現します。

·1年にわたり、VIP来場者に向け150万枚のチケットを確実に配ります

·VIPバイヤー500人からなる団体を無料バスで迎えたり、送ったりし、誘いを受けており、無料でサミットのような活動に参加します

·1ヶ月あたり、200万のSMSを発信し、展示会や出展者に関する情報180万通を配信します。

·50以上の業界メディアは、オンライン・オフラインの手段で展示会や出展者に関する情報を発信します。


For more information about Semiexpo Shenzhen 2019, please call us:

Zhongrui Convention & Exhibition/ Zhongxincai Convention & Exhibition

TEL: +86-755-33375788

Mobile: 13543266785

Contact: JennyJia
 E-mail:   jenny.jia@touchchinaexpo.com

Or log into: www.sz-semiconductor.com

更多»组织机构

主办单位 :

中国通信工业协会
深圳市半导体行业协会

江苏省半导体行业协会
浙江省半导体行业协会
深圳市中新材会展有限公司

承办单位:
深圳市中新材会展有限公司

更多»下载中心
返回顶部