公告:
Scope of display

Exhibition scope:

Semiconductor design, packaging and testing, manufacturing companies

Raw materials

-----Silicon wafers, photoresists, photomasks, special gases, CMP polishing materials, wet electronic chemicals, sputtering targets, packaging and testing materials;

Production equipment

-----Single crystal furnaces, oxidation furnaces, diffusion equipment, ion implantation equipment, PVD, CVD, lithography machines, etching machines, polishing machines, chamfering machines, gluing/developing machines, front-end test equipment, wet process equipment, thermal processing and coating equipment, single wafer deposition systems, cleaning equipment;

Packaging process

------Thinning machines, dicing machine, chip mounters, wire bonders, laminating machines, bending equipment, sorting machines, testing machines, grinding fluid, dicing solutions, sealing film (glue), high temperature tapes; other materials and equipment.



更多»组织机构

主办单位 :

中国通信工业协会
深圳市半导体行业协会

江苏省半导体行业协会
浙江省半导体行业协会
深圳市中新材会展有限公司

承办单位:
深圳市中新材会展有限公司

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